Application
Drilling
| Drilling Machine |
Material: Glass
Industry: Semiconductor packaging industry/Silicon photonics industry
Description:TGV (through glass via)
□ Precise & accuracy < 1microns
□ Fast > 6000 holes/sec
□ Stability
Semiconductor packaging industry/Silicon photonics industry
Glass TGV (through glass via)
Semiconductor packaging industry/Silicon photonics industry
Glass TGV (through glass via)
Semiconductor packaging industry/Silicon photonics industry
Glass TGV (through glass via)
Semiconductor packaging industry/Silicon photonics industry
Glass TGV (through glass via)
