Model: WMK-A323

● Can be matched with automation
FOUP (Cassette) in/FOUP (Cassette) out
● Robot
1）Equipped with a mapping sensor to pre-detect whether the wafers in the cassette are stacked or tilted before taking them out to avoid malfunctions.
2）Double arms to shorten wafer exchange time.
● Visual alignment identification of notch and wafer position, calibration, and centering.
● MES material account management: SECS/GEM.