Product Introduction
Cutting Machine
● Multiple clamping materials can maintain automatic operation for a long time.
● Cutting accuracy <±10 μm.
● AOI detects the size and cutting position of the product.
● Uses robotic arms for discharging and sorting.
● The LCM series laser micromachining system is designed for high-precision processing of IC substrates, including irregular geometric shape cutting, grooving, and marking of substrates.
● The system consists of several subsystems: automatic loading and unloading, substrate transmission, laser workstation, visual inspection, good/defective product separation device, and dust removal and cleaning.
● Fully automatic high-precision UV laser processing equipment, capable of precise processing according to CAD drawings.
● The inlet and outlet structure are convenient, easy to operate, and have a user-friendly design.
● Small thermal effect and low carbonization.
● Tray offload P/P programmable variable spacing system can make real-time changes according to the spacing of the product and the corresponding Tray disk.
