● The difference in diameter between the upper and lower openings can be controlled to <30 μm.
● The workable compound thickness can reach 1,000μm.
● Operation accuracy <±10 μm, Cpk >1.67.
Industry: Semiconductor packaging industry/Silicon photonics industry
Description:TGV (through glass via)
□ Precise & accuracy < 1microns
□ Fast > 6000 holes/sec
□ Stability
Industry: Medical
Description: 30 microns/40 microns
Industry：EMS (Electronics Manufacturing Services)
Industry: Semiconductor Packaging
Description: Precise 2.5D material removal
